PCB Assembly-Jetfgo circuits Group Limited

TECHNOLOGY

PCB Assembly Service

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PCB Manufacturing

In-house fabrication ensures quality and delivery

PCB Stencil

Custom laser-cut stencils for precise solder paste application

Parts Sourcing

Global component procurement with cost control

PCB Assembly

SMT, THT, mixed technology, BGA, fine-pitch

IC Programming

On-board programming with support for major platforms

PCBA Testing

AOI, ICT, functional testing, X-ray for BGA/QFN

Prototype PCB Assembly

Fast build for design validation, starting from 1 piece

Turnkey PCB Assembly

We handle everything – manufacturing, sourcing, and assembly

Jetfgo provide professional PCB assembly services with a strong foundation in PCB manufacturing. Our integrated capabilities include stencil production, parts sourcing, SMT assembly, IC programming, and functional testing — all under one roof. Whether for prototyping or full-scale production, we help bring your designs to life with speed and precision.

PCB Assembly Equipment

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GKG Fully Automatic Solder Paste Printing Machine

*Maximum PCB size that can be accommodated: 400*340mm

*System alignment accuracy and repeatability: ±0.01MM

*Actual solder paste printing accuracy: ±0.025MM

Yamaha YSM20 Pick and Place Machine

*Supported PCB Size: 50*50mm-400*340mm

*Placement Accuracy: 0.025mm

*Component Size: 01005

*Maximum Supported Component Types: 128

Wave soldering

*Preheating time: Less than 15 mins

*PCB width range: 50*450 mm

*PCB entrance height from ground: 750 ± 20 mm

*Transport speed: 0-1800 mm/min

AOI Inspection System

*Camera: 5MP, 20µm resolution

*Component Defects: Missing parts, misalignment, skewness, tombstoning, sideways standing, flipped parts, reversed polarity, wrong parts, damage

*Solder Joint Defects: Too much solder, too little solder, solder bridging, dirt, cold solder joint

SMT Intelligent First Article Tester

*Bridge: High-precision LCR bridge

*Basic measurement accuracy: 0.05%

*Test frequency: 50Hz-100kHz, 34 points

Fully Automatic Solder Paste Mixer

*Working Capacity: 500g * 2 cans

*Acceptable Solder Paste Cans: M cans, diameter Φ60-Φ67

*Time Setting:

0.1~99S, adjustable in 0.1S increments;

0.1~30min, adjustable in 0.1Minute increments.

X-Ray Detector

*Stage Size: 40mm*440mm

*Platform Tilting Angle: ±30°

*X-ray Tube Type: Reflective Sealed Microfocus X-ray Source

*Field of View: 65mm*65mm

*Resolution: 1080p 30fps

*Field of View Angle: 90°

*Focusing: 4x Digital Zoom

3D-SPI Inspection Instrument

*Inspection Items: Volume, Area, Height, XY Offset, Shape

*Defect Types: Missing Print, Excessive Solder, Insufficient Solder, Solder Bridging, Offset, Shape Defects

*Minimum Inspection Element: 01005 (Imperial)

*510*505mm PCB Carrier Dimensions; 480*490 Inspection Area