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High Frequency Board

Number of layers: 2
Plate: Rogers5880
Surface treatment: Shenjin Power
Plate thickness: 0.15mm
Minimum hole: 0.25mm
Line width line distance: 3.9 / 3.9mil
Process: Local Power 120 micro inches

Product Details

Surface finishes： HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG, Selective hard gold plating.

Regular materials： FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883,Panasonic M6/M7, Bergguist etc.

Special technologies： Blind & buried vias, POFV, edge plating, castellated holes, step mounting holes, controlled depth holes, metal based (core), step gold finger, back drill,partial hybrid pressing, bus bar, embedded coin, embedded ceramic etc.

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Process: Local Power 120 micro inches

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Minimum Hole: 0.35mm
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Layers: 8
Material: FR-4
Surface Finish: ENIG
Board Thickness: 2.5mm
Minimum Hole: 0.3mm
Line Width & Space: 6 / 6mil
Special Technology: 1 Step HDI, Heavy Copper(3oz), Depth Milling

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Layers: 12
Meterial: FR-4
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Mertail: FR-4

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