Hybrid Board
Layers: 3
Material: F4BME+RoGERS4450
Surface Finish: ENIG
Board Thickness: 3.2mm
Minimum Hole: 0.3mm
Line Width & Space: 5 / 5mil
Special Technology: Hybrid, Step board, Half hole, Edge plating, Depth Milling
Material: F4BME+RoGERS4450
Surface Finish: ENIG
Board Thickness: 3.2mm
Minimum Hole: 0.3mm
Line Width & Space: 5 / 5mil
Special Technology: Hybrid, Step board, Half hole, Edge plating, Depth Milling
Surface finishes: HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG, Selective hard gold plating.
Regular materials: FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883,Panasonic M6/M7, Bergguist etc.
Special technologies: Blind & buried vias, POFV, edge plating, castellated holes, step mounting holes, controlled depth holes, metal based (core), step gold finger, back drill,partial hybrid pressing, bus bar, embedded coin, embedded ceramic etc.





































